ConferenceEngineeringElectrical and Electron...
International Conference on Electronics Packaging and Assembly Engineering
IC-EPAE
Wed, Dec 2, 2026
San Francisco, United States
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
ConferenceEngineeringElectrical and Electron...
International Conference on Electronics Packaging and Assembly Engineering
IC-EPAE
Wed, Dec 2, 2026
San Francisco, United States
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers
electronics packaging
assembly engineering
PCB design
microelectronics
VLSI
embedded systems
electronics engineering
signal processing
control systems
power electronics
thermal management
computational modeling
energy efficiency
testing and verification
system reliability
hardware optimization
device fabrication
energy materials
performance analysis
energy management
Important Dates
Start Date
Wednesday, December 2, 2026
Registration Deadline
Tuesday, November 17, 2026
Submission Deadline
Thursday, November 12, 2026
Venue
San Francisco, San Francisco, United States
San Francisco, United States